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DATA SHEET
MOS INTEGRATED CIRCUIT
PD16882
MONOLITHIC CD-ROM/DVD-ROM 3-PHASE SPINDLE MOTOR DRIVER
DESCRIPTION
The PD16882 is a CD-ROM/DVD-ROM 3-phase spindle motor driver consisting of a CMOS controller and MOS bridge outputs. By employing 3-phase full-wave PWM as the drive method and MOSFETs at the output stage, it has been possible to reduce the power consumption of the PD16882 ever further than the drivers that use bipolar transistors. By using a 30-pin shrink SOP package, a more compact-size has been achieved.
FEATURES
* * * * * * * * * * * * * * Supply voltage for controller block: 5 V, supply voltage for output block: 12 V Low on-state resistance (total on-state resistance of upper and lower transistors) output RON = 1.1 (TYP.) Low power consumption due to 3-phase full-wave PWM drive method On-chip hole bias switch (linked with STB pin) On-chip IND pulse switching function START/STOP pin included, acting as a brake during STOP Brake pin enabling reverse brake and short brake switching Standby pin included, turning off internal circuit in standby (Output high impedance) Low current consumption: IDD = 3 mA (Max.), IDD (ST) = 1 A (Max.) On-chip thermal shutdown circuit On-chip undervoltage lockout circuit Overcurrent protector (can be externally set by external resistor) On-chip reverse revolution prevention circuit 30-pin plastic shrink SOP (7.62 mm (300))
ORDERING INFORMATION
Part Number Package 30-pin shrink SOP (7.62 mm (300))
PD16882GS
The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for availability and additional information.
Document No. S13966EJ1V0DS00 (1st edition) Date Published February 2001 N CP(K) Printed in Japan
(c)
2001
PD16882
1. ABSOLUTE MAXIMUM RATINGS (TA = 25C)
Parameter Supply voltage Symbol VDD VM Output pin voltage Input voltage Instantaneous output current Power consumption
Note 2 Note 1
Conditions Control block Motor block
Ratings -0.5 to +6.0 -0.5 to +13.5 -0.5 to +15.0 -0.5 to VDD + 0.5
Unit V V V V A/phase W C C
VOUT VIN IOP PT TJ (MAX) Tstg PW 5 ms, Duty 10%
2.0 1.0 150 -55 to +150
Peak junction temperature Storage temperature range
Notes 1. Allowable current per phase while on-board 2. When mounted on glass epoxy board (100 mm x 100 mm x 1 mm, copper film area: 15%)
2. RECOMMENDED OPERATING RANGE
Parameter Supply voltage Symbol VDD VM Output pin voltage DC output current Instantaneous output Note current Hole bias current IND pin output current CL pin input voltage Operating temperature range VOUT IO (DC) IOP IHB IFG VCL TA 0 0.1 -20 PW 5 ms, Duty 10% -0.5 -1.5 10 2.5 Conditions Control block Motor block MIN. 4.5 10.8 TYP. 5.0 12.0 MAX. 5.5 13.2 14.8 +0.5 +1.5 15 5.0 0.4 75 Unit V V V A/Phase A/Phase mA mA V C
Note Allowable current value per phase while on-board
2
Data Sheet S13966EJ1V0DS
PD16882
3. ELECTRICAL SPECIFICATIONS (Unless otherwise specified, TA = 25C, VDD = 5.0 V, VM = 12 V)
Parameter Current consumption 1 (during operation) Current consumption (in standby) Symbol IDD IDD
(ST)
Conditions STB = VDD STB = GND
MIN.
TYP. 1.5
MAX. 3.0 1.0
Unit mA
A
[Spindle driver]
Parameter 1. ST/SP, STB, FGsel, BRsel Input voltage, high Input voltage, low Input pull-down resistor 2. Controller block Triangle wave oscillation frequency 3. Hole amplifier Common mode input voltage range Hysteresis voltage Input bias current 4. Hole bias block Hole bias voltage 5. FG output IND-pin voltage, high IND-pin voltage, low 6. Output block Output on-resistance (upper stage + lower stage) Leakage current during OFF Output turn-on time Output turn-off time 7. Torque command Control reference input voltage range Control input voltage range Input current Input voltage difference Dead zone (+) Dead zone (-) 8. Overcurrent detection block Input offset voltage VIO -15 15 mV
Note
Symbol
Conditions
MIN.
TYP.
MAX.
Unit
VIH VIL RIND
1.8 120
VDD 0.8
V V k kHz
fPWM VHch VHhys IHbias
CT = 330 pF 1.0 VH = 2.5 V
75 3.5 15 1.0
V mV
A
V V
VHB VFG_H VFG_L RON IDR (OFF) tON tOFF
IHB = 10 mA IFG = -2.5 mA IFG = +2.5 mA IO = 200 mA TA = 20C to 75C In standby RM = 5 Star connection 4.0
0.3
0.5
0.5 1.3 1.8 10 1.0 1.0 2.0 2.0
V
A s s
V V
ECR EC IIN ECR-EC EC_d+ EC_d- Duty = 100% ECR = 1.5 V to 2.5 V ECR = 1.5 V to 2.5 V
0.3 0.3 30 0.75 0 -100 +50 -50
4.0 4.0 50
A
V mV mV
+100 0
Note Dead zone not included. The under voltage lockout circuit (UVLO) operates with a voltage of 4 V TYP. The thermal shutdown circuit (T.S.D.) operates with TCH > 150C.
Data Sheet S13966EJ1V0DS
3
PD16882
4. PIN FUNCTIONS
Package: 30-pin Plastic Shrink SOP (7.62 mm (300))
Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 IND STB VM VM OUT2 RF RF OUT1 VM VM OUT0 RF RF ISEN CL GND BRsel ST/SP FGsel HB H0- H0+ H1- H1+ H2- H2+ CT VDD ECR EC Pin Name I/O O I - - O O O O - - O O O I I - I I I O I I I I I I I - I I Index signal output pin Standby operation input pin Supply pin for motor block (12 V) Supply pin for motor block (12 V) Motor connection pin 2 3-phase bridge output pin 3-phase bridge output pin Motor connection pin 1 Supply pin for motor block (12 V) Supply pin for motor block (12 V) Motor connection pin 0 3-phase bridge output pin 3-phase bridge output pin Sense resistor connection pin Overcurrent detection voltage input pin GND pin Brake selection pin Start/stop input pin IND pulse selection pin Hole bias pin Hole signal input pin 0 (-) Hole signal input pin 0 (+) Hole signal input pin 1 (-) Hole signal input pin 1 (+) Hole signal input pin 2 (-) Hole signal input pin 2 (+) Oscillation frequency setup capacitor connection pin Controller block supply pin (5 V) Control reference voltage input pin Control voltage input pin Pin Function
4
Data Sheet S13966EJ1V0DS
PD16882
5. BLOCK DIAGRAM
IND STB VM UVLO VM Q5 OUT2 Q6 RF RF Q3 OUT1 Q4 VM + VM Q1 OUT0 Q2 RF CMP0 - Phase excitation pulse generator CMP2 T.S.D + - OSC
EC ECR VDD
CT
H2+ H2- H1+ H1- H0+ H0- HB
+ CMP1 -
FGsel ST/SP
RF ISEN CL
Reverse revolution detection circuit
BRsel GND
Caution
When there is more than one pin of the same kind of pin, all pins should be connected to their targets.
Data Sheet S13966EJ1V0DS
5
PD16882
6. STANDARD CHARACTERISTICS CURVES
PT vs. TA Characteristics 1.4
1.2 25C
Total power dissipation PT (W)
1.0
1.0 W 125C/W
0.8
0.6
0.4
0.2 75C 0 -25 0 25 50 75 100 125 150
Ambient temperature TA (C)
Remark
It is possible to apply a maximum of 1.0 W of power when the ambient temperature is 25C or lower. When the ambient temperature is higher than 25C, derate based on the above chart. It is possible to apply 0.6 W to the IC when the ambient temperature is 75C, which is within recommended ambient temperature conditions.
6
Data Sheet S13966EJ1V0DS
PD16882
Standard Characteristics Curves (Unless otherwise specified, TA = 25C)
IDD and IDD (ST) vs. VDD Characteristics
Torque command block input current IIN (A)
IIN vs. VDD Characteristics (EC and ECR pins) 50 EC = 0.3 V, ECR = 4.0 V 40
2.0
Circuit current IDD (mA) Circuit current in standby IDD (ST) (A)
IDD 1.0
30 IIN 20
10
IDD (ST) 0 4.5 5 Controller block supply voltage VDD (V) 5.5
0 4.5
5 5.5 Controller block supply voltage VDD (V)
VIH and VIL VS. VDD Characteristics (ST/SP, STB, BRsel, and FGsel pins) 2.0
Hole amplifier hysteresis voltage VHhys (mV)
VHhys VS. VDD Characteristics (Hole amplifier input) 30 VH = 2.5 V
Input voltage, high VIH (V) Input voltage, low VIL (V)
25
1.5 VIH VIL
20
15
1.0 4.5
5 Controller block supply voltage VDD (V)
5.5
10 4.5
5 Controller block supply voltage VDD (V)
5.5
fPWM vs. VDD Characteristics 100 CT = 300 pF
PWM oscillation frequency fPWM (kHz)
Ron vs. TA Characteristics 1.5
fPWM
Output on resistance Ron ()
Ron 1.0
50
0 4.5
5 Controller block supply voltage VDD (V)
5.5
0.5 -20
0 20 40 60 Operating ambient temperature TA (C)
80
Data Sheet S13966EJ1V0DS
7
PD16882
7. FUNCTION OPERATION TABLE
(1) ST/SP (start/stop) function Turning ON/OFF the spindle can be controlled by the ST/SP pin while the oscillator is operating. When the ST/SP pin is high, the spindle is activated (operating); when it is low, the spindle stops. When the spindle stops, the MOSFET at the high side is ON and the MOSFET at the low side is OFF, serving as a short brake. * ST/SP = "H"
OUT0 H H H H H H L L L L L L OUT1 H H L L L L L L H H H H Input Signal OUT2 L L L L H H H H H H L L Circuit Operation Low-side PWM ON OFF ON OFF ON OFF ON OFF ON OFF ON OFF Excited (operates) Regeneration (brake) Excited (operates) Regeneration (brake) Excited (operates) Regeneration (brake) Excited (operates) Regeneration (brake) Excited (operates) Regeneration (brake) Excited (operates) Regeneration (brake) WV WU VU VW UW UV Excited Phase
During regeneration (brake), the input signal goes through the channel of the high-side Pch MOSFET. * ST/SP = "L"
OUT0 - Drive Timing (Motor Output Signal) OUT1 OUT2 - - Circuit Operation PWM - Short brake
(2) Torque control The output stage is driven by applying a differential voltage between the control reference voltage (ECR) and control input voltage (EC) pins (ECR-EC). With this product, the ECR-EC differential voltage and output PWM duty have a linear relationship. The input deadband is 50 mV TYP. and the duty of the standard model is 100% at 0.75 V (excluding the deadband). The PD16882 also has a break selection pin (BRsel). When this pin goes high, ECR is less than EC and the brake is applied in the reverse direction (refer to the figure and table on the next page).
8
Data Sheet S13966EJ1V0DS
PD16882
Output duty Forword torque Input deadband 100 mV -0.75 V TYP. (-) +0.75 V TYP. (+) ECR-EC 100% MAX.
100% Reverse torque
If the BRsel pin goes low, a short brake is applied and only the high side is ON if ECR is equal to or less than EC. When the brake is applied in the reverse direction, the PD16882 detects the reverse revolution of the motor and then stops. For ECR-ER and the logic of the BRsel pin, refer to the table below.
BRsel Pin Logic L ECR > EC ECR < EC Forward Short brake H Forward Reverse brake
Note
Note The PD16882 stops after it has detected the reverse revolution of the motor. When the motor revolves in the reverse direction, the counter electromotive force flows into the VM pin via the channel of the highside Pch MOSFET. (3) FG pulse selection function This product can vary index signal (FG) output in proportion to the number of revolutions. Depending on the setting of the FGsel pin, either single-phase output or three-phase synthesized output can be selected. For the logic, refer to the table below.
FGsel Pin Logic L FG pulse output Single-phase output H 3-phase synthesized output
Data Sheet S13966EJ1V0DS
9
PD16882
(4) Standby function The PD16882 has a standby function to lower the power consumption when stopped. In the standby status, the oscillator can be stopped to decrease the circuit current. When STB is made low, the spindle enters the standby mode, and goes into a high-impedance state. When the operation mode is restored, it takes the PD16882 several 10 s to start up.
STB Pin Logic L Circuit status Standby mode H Operation mode
10
Data Sheet S13966EJ1V0DS
PD16882
8. TIMING CHART
(1) Hole signal input
H0
H1
H2
(2) CMP signal (FGsel: GND, single-phase mode (IND1), FGsel: VDD, 3-phase synthesized mode (IND2))
CMP0
CMP1
CMP2
IND1
IND2
(3) Selection of output MOSFET drive and comparator
Q1 Q2 Q3 Q4 Q5 Q6 (SW) SW ON
(SW) SW
(SW) SW ON ON (SW) SW
ON
ON (SW) SW (SW) SW ON
(SW) SW
(SW) SW ON ON (SW) SW
ON
ON (SW) SW (SW) SW ON
ON
(SW) SW
ON
(SW) SW
Data Sheet S13966EJ1V0DS
11
PD16882
(4) Motor drive waveform
OUT0
PWM
PWM
OUT1
PWM
PWM
PWM
OUT2
PWM
PWM
12
Data Sheet S13966EJ1V0DS
12 V 47 F controller IND STB VM UVLO OSC Q5 OUT2 Q6 RF RF Q3 Q4 VM VM Q1 Q2 RF RF RFIL1.8 k 330 pF 0.2 V VCL CL CFIL ISEN Motor U phase OUT0 CMP0 Motor V phase OUT1 CMP2 Phase excitation pulse generator CMP1 + - + - + - T.S.D VM VDD 330 pF CT H2+ H2- H1+ H1- H0+ H0- HB FGsel ST/SP Reverse revolution detection circuit BRsel GND 200 ECR EC CPU
+
15 F
+
5V
9. APPLICATION CIRCUIT EXAMPLE
200
Motor W phase
HW
HV
Data Sheet S13966EJ1V0DS
HU
CPU CPU CPU
Rs 0.2
PD16882
13
PD16882
10. PACKAGE DRAWING
30-Pin Plastic Shrink SOP (7.62 mm (300)) (Unit: mm)
30 16 Detail of lead end
1
13.0 MAX.
15
1.550.1
7.70.3 5.60.2 1.050.2
1.8 MAX.
0.10.1
0.8
+0.10 0.35-0.05
0.10 0.10 M
0.9 MAX.
0.20 -0.05
+0.10
0.60.2
14
Data Sheet S13966EJ1V0DS
3 +7 -3
PD16882
RECOMMENDED SOLDERING CONDITIONS
PD16882 should be soldered and mounted under the following recommended conditions. For soldering methods
and conditions other than those recommended below, contact your NEC sales representative. Surface Mount Type For the details of the recommended soldering conditions, refer to the document Semiconductor Device Mounting Technology Manual (C10535E).
PD16882GS
Soldering Method Infrared reflow VPS Wave soldering Partial heating Soldering Conditions Package peak temperature: 235C, Time: 30 sec. Max. (at 210C or higher), Count: two times, Exposure limit: Not limited Count: two times, Exposure limit: Not limited
Note
Recommended Condition Symbol IR35-00-2 VP15-00-2 WS60-00-1
Package peak temperature: 215C, Time: 40 sec. Max. (at 200C or higher),
Note
Solder bath temperature: 260C Max., Time: 10 sec. Max., Count: once, Note Exposure limit: Not limited Pin temperature: 300C Max., Time: 3 sec. Max., Exposure limit: not Note limited
Note After opening the dry pack, store it at 25C or less and 65% RH or less for the allowable storage period. Caution Do not use different soldering methods together (except for partial heating).
REFERENCE
Quality Grades on NEC semiconductor Devices Semiconductor Device Mounting Technology Manual NEC Semiconductor Device Reliability/Quality Control System Semiconductor Selection Guide C11531E C10535E C12769E X13769X
Data Sheet S13966EJ1V0DS
15
PD16882
[MEMO]
16
Data Sheet S13966EJ1V0DS
PD16882
[MEMO]
Data Sheet S13966EJ1V0DS
17
PD16882
NOTES FOR CMOS DEVICES
1 PRECAUTION AGAINST ESD FOR SEMICONDUCTORS Note: Strong electric field, when exposed to a MOS device, can cause destruction of the gate oxide and ultimately degrade the device operation. Steps must be taken to stop generation of static electricity as much as possible, and quickly dissipate it once, when it has occurred. Environmental control must be adequate. When it is dry, humidifier should be used. It is recommended to avoid using insulators that easily build static electricity. Semiconductor devices must be stored and transported in an anti-static container, static shielding bag or conductive material. All test and measurement tools including work bench and floor should be grounded. The operator should be grounded using wrist strap. Semiconductor devices must not be touched with bare hands. Similar precautions need to be taken for PW boards with semiconductor devices on it. 2 HANDLING OF UNUSED INPUT PINS FOR CMOS Note: No connection for CMOS device inputs can be cause of malfunction. If no connection is provided to the input pins, it is possible that an internal input level may be generated due to noise, etc., hence causing malfunction. CMOS devices behave differently than Bipolar or NMOS devices. Input levels of CMOS devices must be fixed high or low by using a pull-up or pull-down circuitry. Each unused pin should be connected to VDD or GND with a resistor, if it is considered to have a possibility of being an output pin. All handling related to the unused pins must be judged device by device and related specifications governing the devices. 3 STATUS BEFORE INITIALIZATION OF MOS DEVICES Note: Power-on does not necessarily define initial status of MOS device. Production process of MOS does not define the initial operation status of the device. Immediately after the power source is turned ON, the devices with reset function have not yet been initialized. Hence, power-on does not guarantee out-pin levels, I/O settings or contents of registers. Device is not initialized until the reset signal is received. Reset operation must be executed immediately after power-on for devices having reset function.
18
Data Sheet S13966EJ1V0DS
PD16882
Regional Information
Some information contained in this document may vary from country to country. Before using any NEC product in your application, pIease contact the NEC office in your country to obtain a list of authorized representatives and distributors. They will verify:
* * * * *
Device availability Ordering information Product release schedule Availability of related technical literature Development environment specifications (for example, specifications for third-party tools and components, host computers, power plugs, AC supply voltages, and so forth) Network requirements
*
In addition, trademarks, registered trademarks, export restrictions, and other legal issues may also vary from country to country.
NEC Electronics Inc. (U.S.)
Santa Clara, California Tel: 408-588-6000 800-366-9782 Fax: 408-588-6130 800-729-9288
NEC Electronics (Germany) GmbH
Benelux Office Eindhoven, The Netherlands Tel: 040-2445845 Fax: 040-2444580
NEC Electronics Hong Kong Ltd.
Hong Kong Tel: 2886-9318 Fax: 2886-9022/9044
NEC Electronics Hong Kong Ltd. NEC Electronics (France) S.A.
Velizy-Villacoublay, France Tel: 01-30-67 58 00 Fax: 01-30-67 58 99 Seoul Branch Seoul, Korea Tel: 02-528-0303 Fax: 02-528-4411
NEC Electronics (Germany) GmbH
Duesseldorf, Germany Tel: 0211-65 03 02 Fax: 0211-65 03 490
NEC Electronics (France) S.A. NEC Electronics (UK) Ltd.
Milton Keynes, UK Tel: 01908-691-133 Fax: 01908-670-290 Madrid Office Madrid, Spain Tel: 91-504-2787 Fax: 91-504-2860
NEC Electronics Singapore Pte. Ltd.
United Square, Singapore Tel: 65-253-8311 Fax: 65-250-3583
NEC Electronics Taiwan Ltd. NEC Electronics Italiana s.r.l.
Milano, Italy Tel: 02-66 75 41 Fax: 02-66 75 42 99
NEC Electronics (Germany) GmbH
Scandinavia Office Taeby, Sweden Tel: 08-63 80 820 Fax: 08-63 80 388
Taipei, Taiwan Tel: 02-2719-2377 Fax: 02-2719-5951
NEC do Brasil S.A.
Electron Devices Division Guarulhos-SP Brasil Tel: 55-11-6462-6810 Fax: 55-11-6462-6829
J00.7
Data Sheet S13966EJ1V0DS
19
PD16882
* The information in this document is current as of December, 2000. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products and/or types are available in every country. Please check with an NEC sales representative for availability and additional information. * No part of this document may be copied or reproduced in any form or by any means without prior written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document. * NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC semiconductor products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC or others. * Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of customer's equipment shall be done under the full responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. * While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC semiconductor products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment, and anti-failure features. * NEC semiconductor products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products developed based on a customer-designated "quality assurance program" for a specific application. The recommended applications of a semiconductor product depend on its quality grade, as indicated below. Customers must check the quality grade of each semiconductor product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness to support a given application. (Note) (1) "NEC" as used in this statement means NEC Corporation and also includes its majority-owned subsidiaries. (2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for NEC (as defined above).
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